stage-Montable and peeling table Anti-adhesive surface processing

Description

Model No. table stage for IC

Made in Taiwan, ROC

Anti-adhesion processing with TSK

SPEC
BW :clear

Heat-resistant range :***0 celsius degree



Key Features



Nano SiC anti-sticking surface processing for semiconductor optoelectronic areas such as large panel sucker, semiconductor wafer vacuum sucker. There are many types of wear mechanisms including adhesive, abrasive, erosive, capitation, and fretting.In many cases wear can occur from a combination of these mechanisms.Understanding the factors that are causing wear to occur is very important to engineering the proper wear resistant coating



Payment Terms: D/A, TT, L/C