Description

The ZLH **6 Laser saw machine is using industrial lasers, linear motor workbench and straight drive rotary platform, assisted by CCD image monitoring and positioning system, to cutting semiconductor wafer.

The machine has mounted with LCD touch screen, man-machine operation interface; the image alignment of the work piece is simple and convenient to improve the operation convenience. The self design software is used in the control system to improve the cutting efficiency. The equipment has high reliability, low cost maintenance and stable performance



Feature
Interactive man-machine operation interface
*5" high resolution touch screen;
Easy operation, highly working efficiency;
Fiber Laser adopted;
Laser wave is ***4 nm;
Power rating is *@********************tor workbench with 2um accuracy.

Application
IC wafer, GPP, diode wafer, monocrystalline, polysilicon, amorphous silicon solar cells, scribing dicing for silicon wafer, slotting for LOW-K materials, etc.

Specification