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Diamond Dicing Blade for motherboard grooving

Diamond Dicing Blade for motherboard grooving

20 ~ 60 / Piece ( Negotiable )

|

Minimum Order

Place of Origin:

-

Price for Minimum Order:

Minimum Order Quantity:

5 Piece

Packaging Detail:

Outer packaging: hard carton Filling: plastic foam pad

Delivery Time:

15 work days

Supplying Ability:

1000 Piece per Month

Payment Type:

PayPal, D/A, D/P, T/T

الاتصال الآن
عضو مجاني

الشخص الذي يمكن الاتصال به Mr. Jason Guo

No.0906, 9F, Unit 2, No.11 Complex Building, No.171 Zhongyuan Middle Road, Zhongyuan District, Zhengzhou, Henan

الاتصال الآن

Description

  Brief Introductions:  

Type: 1A1R
Bond: Resin or Metal
Application: Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa*3 LiNb*3 (devices), QFN(copper epoxy molding ), splitter, sapphire
Specification: Customized
Brand Mark: Moresuperhard
Trade Terms: FOB
Packages: Hard carton
Delivery Time: *5 workdays by express
 
  Introductions of Moresuperhards Dicing Blades  
Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.
 
D(mm) T(mm) U(mm) H(mm) X(mm)
4 /**0 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 0.4, 0.5, 0.6, 0.8, 1.0, 1.3. *0, *1.*5 5, *0
5/ **5 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 0.4, 0.5, 0.6, 0.8, 1.0, 1.3 *0, *1.*5 5, *0
6/ **0 0.6, 0.8, 1.0, 1.2, 1.5, 1.8 0.5, 0.6, 0.8, 1.0, 1.3, 1.6 *0, *1.*5 5, 7, *0
8/ **0  0.8, 1.0, 1.2, 1.5, 1.8 0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5. *0, *1.*5 5, 7, *0
*2/ **0 1.0, 1.2, 1.4, 1.5, 1.7, 1.8 0.7, 0.9, 1.1, 1.4 *0, *1.*5 5, 7, *0
*6/ **0 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 0.9, 1.2, 1.4, 1.6, 2.0 *0, *1.*5 5, 7, *0
*0/ **0 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 0.9, 1.2, 1.4, 1.6, 2.0 *0, *1.*5 5, 7, *0
Other size can be made according to customers requirement
 
Detailed Specifications can be customized!
  Advantages of Moresuperhards Dicing Blades  
Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish
Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.
Able to precisely control diamond concentration to achieve cutting quality
Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to **0μm depending on blade thickness  

Send a direct inquiry to this supplier

إلى:

Mr. Jason Guo < Henan MoreSuperHard Products Co Ltd. >

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