FOB Price
أحصل على آخر سعر( Negotiable )
|Minimum Order
Place of Origin:
-
Price for Minimum Order:
-
Minimum Order Quantity:
10 Piece
Packaging Detail:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
Delivery Time:
3-7days
Supplying Ability:
-
Payment Type:
T/T
الشخص الذي يمكن الاتصال به Sophia
B8 building, Dongguan, Guangdong
Ziitek TIF**5AB**5S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.
Feature
<
Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor
| Typical Properties of TIF**5AB**5S Series | |||
| Typical Uncured Material | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Blue | Visual | |
| Viscosity as Mixed (cps) | **0,**0 cps | ASTM D***6 | |
| Density | 3.1g/cc | ASTM D**2 | |
| Mix Ratio | 1:1 | ****** | |
| 6 months | ****** | ||
| Cure Schedule | |||
Pot Life
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