ENIG PCB

الوصف

PCB Specification：

Size                   **0 x **0mm
Material             FR4
No of Layers    4
Thickness        1.6
Finish                ENIG
Copper Weight  1.0oz       
Solder mask    Green,LPI
Legend              White
Profilling            CNC
Packing              Vacuum plastic and cartons
Application         Communication

The design does not contain Blind Vias 
The design does not contain Buried Vias  
The design does not contain holes smaller than 0.*5mm (0.**0inches)

The design conforms to the following design rules
(For multilayer boards)
Minimum track thickness 5 mil (0.*3mm)
Minimum track clearance 5 mil (0.*3mm)
(For single and double sided boards)
Minimum track thickness 6 mil (0.*5mm)
Minimum track clearance 6 mil (0.*5mm)

Layer Description
(Note: Inner layers are counted from the top downwards)

Top Silk Screen Overlay      Designname.GTO
Top Solder Mask                  Designname.GTS
Top Copper                           Designname.GTL
Inner Copper 1                     Designname.G1
Inner Copper 2                     Designname.G2
Bottom Copper                     Designname.GBL
Bottom Solder Mask            Designname.GBS
Bottom Silk Screen              Designname.GBO
NC Drill File                           Designname.GDD
Outline                                    Designname.GM1