Printed Circuit Board

الوصف

Size                      **0 x **0mm
Material                FR4
No of Layers        4
Thickness            1.6
Finish                    HASL (Lead free) (RoHS)
Copper Weight    1.0oz       
Solder mask        Green,LPI
Legend                  White
Panel Form           2*2
Profilling                V-CUT,CNC
Packing                 Vacuum plastic and cartons
Application            Communication
 

The design does not contain Blind Vias 
The design does not contain Buried Vias  
The design does not contain holes smaller than 0.*5mm (0.**0inches)

The design conforms to the following design rules
(For multilayer boards)
Minimum track thickness 5 mil (0.*3mm)
Minimum track clearance 5 mil (0.*3mm)
(For single and double sided boards)
Minimum track thickness 6 mil (0.*5mm)
Minimum track clearance 6 mil (0.*5m)


Layer Description
(Note: Inner layers are counted from the top downwards)

Top Silk Screen Overlay   Designname.GTO
Top Solder Mask               Designname.GTS
Top Copper                        Designname.GTL
Inner Copper 1                  Designname.G1
Inner Copper 2                  Designname.G2
Bottom Copper                  Designname.GBL
Bottom Solder Mask         Designname.GBS
Bottom Silk Screen           Designname.GBO
NC Drill File                        Designname.GDD
Outline                                 Designname.GM1