IC Design Application PCB

• Any layer HDI;
• Aspect ratio up to *5;
• Back drill;
• Board thickness *0 mm / **0 mil;
• Cavity down;
• High speed and low loss materials;
• Layer count up to *0;
• Micro via copper-fill plate;
• Minimum line width / spacing 2 mil (*0 micro meters);
• Thermal management-coin inserted;
• VIP (via in pad) : conductive-conductive copper paste ; non-conductive-epoxy via hole fill

Applications 

Smart Phones, Internet of Things, Multimedia A/V, Telecommunication Equipment, Sensing Component, Smart TV, DVD/Blu-ray Storage System, Smart Audio System, Home Networking Device System, Smart CPU&GPU, Broadband Gateway and Set-top Box, Tablet, LTE Modem Platform, RF Transceiver, NFC( Near Field Communication) Product, Bluetooth Product, GPS (Global Positioning System) Product, Wireless Charging and Wearable Device.