Microwave and Telecommunication Equipment PCB

الوصف

Technologies

• Any layer HDI;
• Aspect ratio up to *5;
• Back drill;
• Board thickness *0 mm / **0 mil;
• Cavity down;
• Diversity specialty processes PCB & PCBA;
• Heavy-copper products up to 6 oz(**0 µm);
• High speed, low loss and multiple material combination / RF microwave high performance  material;
• IPC-A***0 class 3 certified products;
• Layer count up to *0;
• Metal core PCB (aluminum & copper) /coin thermal management;
• Micro via Cu fill plate;
• Minimum line width / spacing 2 mil;
• Rigid-flex PCB;
• Tightened impedance control tolerance;
• VIP (via in pad) :conductive-copper paste / conductive paste ;non-condective-epoxy via hole fill