الوصف

RF4 RF***6A 0.6mm **8A RF*0.8mm **0g / RF***3D 0.3mm RF***4D 0.4mm RF***6D 0.6mm RF***8D 0.8mm RF***0D 1.0mm **0g Sn*3% Lead-Free Rosin Core Solder Tin Wire. RF4 BGA desoldering wire for mobile phone motherboard SMD PCB welding repair tool.

Features:

1. Environmentally friendly and lead-free.
2. Good wettability, conductivity, and resistance to heat fatigue.
3. The solder joint is smooth and it can effectively resist oxidation.
4. Fast spreading speed even with small holes.
5. The solder wire is wound up evenly with a roll for easy sorting and preservation.

1. Option1: RF4 RF***6A **0g 0.6mm
2. Option2: RF4 RF***8A **0g 0.8mm
3. Option3: RF4 RF***3D **0g 0.3mm
4. Option4: RF4 RF***4D **0g 0.4mm
5. Option5: RF4 RF***6D **0g 0.6mm
6. Option6: RF4 RF***8D **0g 0.8mm
7. Option7: RF4 RF***0D **0g 1.0mm

1. Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick. The solder will be absorbed.
2. Remove both the desoldering wick and the soldering iron tip from the PCB after the solder has been absorbed.
3. Cut off the used section of the wick using nippers.
4. Repeat steps 1,2 and 3 if the solder is not removed completely. Absorbability may differ depending on the type of solder. Sn*3% and *0% (tin content) have good absorbability.

Caution:

1. To prevent injury, do not touch the wicks directly while desoldering. Hold the case, or use tweezers, etc.
2. Do not force the tip against the desoldering wick, do not heat for more than 5 seconds to avoid hurting yourself or damaging parts and PCB.

1. Only touch the grip and the pack of desoldering wick when desoldering. Failure to do so will result in serious burns.
2. To avoid fire, never use a soldering iron and desoldering wick around combustibles or in an explosive environment.

• 1 x Solder Tin Wire