Solderball Pin

الوصف

Product Description

Solderball Pin Technology 
Packaged in Tape and Reel for use with standard feeders for automated placement. The product contains a Solderball that maintains its shape during multiple solder reflow processes. The PC board or device can then easily be soldered to pads on another parallel PC board. The Solderball pins accommodate up to 0.**8 mm (0.**0 in) coplanarity variation with high current reliability. 
Additional Information 
Pin terminal - High Conductivity Copper alloy 
Solder sphere - RoHs Compliant SAC alloy or Tin/Lead 
Packaging - STD *6 mm (0.**9 in) Tape & Reel per Spec EIA***1 
Pick & Place - Pin through paste via standard SMT equipment 
Applications 
Solderball Pin™ Technology is engineered and widely used on POL (point of load) DC/DC Power applications when a PCB mezzanine design is necessary due to real estate limitations, offering additional thermal dissipation capability via the robust mechanical connection. 

Compact configuration and flexibility as a discrete SMT component facilitates adoption into a broad scope of applications, including electronic lighting controls, remote telemetry monitoring, Ethernet, fibre channel, storage area networks, automotive, and many other daughter-to-motherboard module-based subassemblies. 
Benefits 
Automatic coplanarity compensation*: 
0.**8 mm (0.**0 in) 
High current carrying capability*: *0 amp DC 
Converts through hole device into SMT 
Conducts heat from device to Host PCB 
*Consult Factory for Specific Product Performance and 
Engineering characteristics