Material type: polyimide Layer count: 2 Min trace width/space: 4 mil Min hole size: 0.*0mm Finished board thickness: 0.*0mm Finished copper thickness: *5um Finish: ENIG Solder mask color: red...
    PCB OEM EMS

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    OEM ODM Services OEM ODM Pcb Boards PCB Assembly Cable Assembly Cable Assembly Manufacturer PCB Assembly Manufacturer Electronic Compon...

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    ARM embedded Rockchip SOM RK***8 Android Ubuntu AIOT core board Product Description Model: i***8CV1 Optional configuration: RAM LPDDR4 +ROM eMMC 4**6G and 8**2G The SOM core board is the main comp...

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    Stamp Hole Core Board RK***8S SOM for Interactive Self-Service Terminal Product Description Model: x***6cv2 Optional configuration: RAM LPDDR4 +ROM eMMC 2**6G and 4**6G Product Features ROCKCHIP R...

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    Rockchip RK***9 RK***9pro ARM BOARD for Cash Register Product Description Model: ***9PROcv1 Optional configuration: RAM LPDDR4 +ROM eMMC 2**6G and 4**6G Product Features ARM dual-core Cortex-A*2+ ...

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    Rockchip Android Board PX*0 for Smart Home Product Description Model: x*0cv1 Optional configuration: RAM LPDDR4 +ROM eMMC 2**6G and 4**6G Features of SOM for Smart Home Quad-core Cortex-A*5 dual-c...

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    PRODUCT DESCRIPTION Teflon Diclad **7 Board Thickness 0.5 mm Base Material Teflo...

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    Base Material polyimide/FR*4 Board Thickness 1.2 mm Other attributes Model Number KF****5 Place of Origin Guangdong, China Copper Thickness 1 OZ Min. Hole ...
    Base Material PI Board Thickness 0.*5mm Board Size **0mm **0mm Other attributes Model Number TH******5 Place of Origin Guangdong, China Copper Thickness 1o...
    Base Material PI Board Thickness 0.*5mm Board Size **0mm **0mm Other attributes Model Number TH******5 Place of Origin Guangdong, China Copper Thickness 1o...
    PRODUCT DESCRIPTION PCBA Application Industrial control equipment CHIP Size ***2 QFP Pin Spacing 0.4mm QFN Pin Spacing 0.4mm BGA Ball Sp...

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    PRODUCT DESCRIPTION PCBA Application Power supply equipment CHIP Size ***2 QFN Spacing 0.4mm QFN Spacing 0.4mm Package Type Tape package, Tay tray package, Pipe package

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    PRODUCT DESCRIPTION Rigid-flexible PCB material introduction Mixed materials including RF and high speed, standard FR*4, polyimide flex. Adhesiveless or adhesive based polyimide flex ...

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    PRODUCT DESCRIPTION RO***3C Laminates Rogers RO***3C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass ...

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    PRODUCT DESCRIPTION Layer Count: 8 Layer 2*4*2, 1 level HDI Rigid-Flex Structure: 6R*2F Material: Nanya FCCL, ITEQ FR*4 Tg**0, *4V*0, RoHS Finished FPC T...

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    Polyimide film, Kapton film likely, has many good properties including electrical , thermal , mechanical , physical and chemical features over a wide range of temperatures from **9 to **0 . nb...
    Metal Core PCB Thermal Conductivity ****8W/m.K Aluminum/Copper AC *******0V Post-bonding/Pre-bonding Sweat-Soldering/Conductive Adhesive Press-Fit/Embedded Coin I, T U Founded in ***7, PEAK Co., ...

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    IC Substrate Substrate-Like PCB CSP/FC-CSP/SIP/FC-BGA/WB-CSP FR4/BT/High-Speed Material Trace Width/Space *2/*2 m SM Registration: *0 m Strict SM Flatness Control 5 m Found...

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    Supplier: Grande Electronics Application:Electric Vehicle Warning Sounds System PCB Layout Software: PADS Layers:4 Features: 1, Various machine interfaced. 2, Equal-length for high sp...

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    Supplier:Grande Electronics Layers: 4 Application: Vehicular Communication System Circuit Board PCB Fabrication and Manufacturing PCB Parameter: FR*4/HTG**0 Thickness: 1.6mm Surface Treatmen...

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    Supplier: Grande Electronics Layers: 4 Application: Satellite System and Aerospace PCB Manufacture Service - Grande Electronis PCB Parameter: FR*4/HTG**0 Thickness:1.6mm Surface Treatment: E...

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    Supplier:Grande Layers: 4 Application: Vehicular Communication System Circuit Board PCB Fabrication and Manufacturing PCB Parameter: FR*4/HTG**0 Thickness: 1.6mm Surface Treatment: ENI...

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