Shenzhen Kaizhitong Microelectronics Technology Co., Ltd

Apply to BGA153 and BGA169. eMMC size of this product is 11.5x13mm, we also provide other sizes of 12x16mm, 12x18mm and 14x18mm. Apply to eMMC thick

eMMC eMCP test socket all in one, 3in1 socket with USB Interface, for BGA153 BGA169 BGA162 BGA186 BGA221, for data recovery

Features: 1. Apply to Samsung, Sandisk, Toshiba, Hynix, Micron, MTK, Intel, etc--eMMC 2. Apply to BGA169. 3. Accurate positioning on flat bottom pa

Features: 1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC and Intel. 2. Apply to BGA153 and BGA169. 3. eMMC size of this product

1. eMCP adapter for BGA 221, compatible with all brand eMCP, like Sumsung, Toshiba, Hynix, Sandisk, Intel, etc. 2. Easy to operate, put the eMCP into

1. Apply to eMCP of Sumsung, Sandisk, Toshiba, Hynix, Micron, MTK and Intel. 2. Apply to BGA 162 and BGA 186. 3. Easy operation by just inserting the

Features: 0.aluminium alloy socket. 1. Apply to Samsung, Sandisk, Toshiba, Hynix, Micron, MTK, Intel, etc--eMCP 2. Apply to BGA162. 3. Accurate positi

Feature: 1. Model : eMCP221 ball , Pin Pitch 0.5mm 2. Boundary dimension : 25mm*25mm*4mm 3. Gap Height : 2mm ( To avoid integrated circuit surrounding

1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel. 2. Apply to BGA 169 and BGA 153 testing. 3. eMMC data could be rea

Product Feature : 1. Use double contact technology , contact more stable , 2. The socket shell use special engineering plastic , high strength , long