Headpcb

Project Description |Parameters 6 Layer Thickness: 1.8+/-0.18 mm Min Hole Size: 0.25 mm Width/Space: 0.2mm/0.2 mm Surface Treatment: ENIG |Craft Gold

Project Description |Parameters 1 Layer Thickness: 1.2+/-0.1 mm Min Hole Size: 3.175 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: OSP |Craft Whit

Project Description |Parameters 2 Layer Thickness: 0.63+/-0.06 mm Min Hole Size: 0.4 mm Width/Space: 0.16mm/0.13 mm Surface Treatment: ENIG

Project Description |Parameters 28 Layer Thickness: 1.986+/-0.19 mm Min Hole Size: Via: 0.20 mm Blind Via: 0...

Project Description |Parameters 4 Layer Thickness: 1.2+/-0.12 mm Min Hole Size: 0.3 mm Width/Space: 0.12mm/0.12 mm Surface Treatment: ENIG |Craft Red

Project Description |Parameters 2 Layer Thickness: 0.6+/-0.1 mm Min Hole Size: 0.5 mm Width/Space: 0.3mm/0.3 mm Surface Treatment: Immersion Silver |

Project Description |Parameters 4 Layer Thickness: 1.6+/-0.16 mm Min Hole Size: 0.4 mm Width/Space: 0.25mm/0.2 mm Surface Treatment: ENIG |Craft Coun

P Project Description |Parameters 4 Layer Thickness: 1.8+/-0.18 mm(High Tg S1000-2 Material) Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surface

Project Description |Parameters 10 Layer Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+Gold Finge

Project Description |Parameters 1 Layer Thickness: 1.5+/-0.1 mm Min Hole Size: 2.15 mm Width/Space: 0.18mm/0.16 mm Surface Treatment: HASL-LF |Craft