PCBMAIN Technology Co., Ltd

1-4layers, Copper weight: 1oz-4OZ Surface finish: HASL, ENIG, Immersion tin, OSP Max. Board dimension: 1100*480mm Min. Board dimension: 5*5mm Bo

SMT Stainless steel stencil for pcb assembly: Thickness: 0.10mm, 0.12mm, 0.15mm, 0.20mm Framed or frameless Active cutting area: 600X600mm Largest

Layer:1-40; Product type: Back board, HDI, Blind/Burried vias multilayer, Capacitor Embedded board, Power supply, Thick gold, Thick copper board,

Single Layer, double layer, multi-layer, flex-rigid Base material: PI, PET, FR4 Copper weight: 9um, 12um, 18um, 35um, 70um Surface finish: HA

Layer:1-40; Board Material:FR4, High Tg, Aluminum Base, High Frequency, Rogers, PTFE, FPC, Thick Copper, Paper Base, BT Base, PI Base, Rogers, Arl

Board type: HDI, 6 layers Thickness: 1.0mm Blind via:L1-L2, L2-L3, L3-L4, L4-L5, L5-L6 Smallest hole: 0.1mm Min. tracing/spacing: 3.8mil/3.8mil M

High Tg(Tg 170) FR4, thick copper, 4OZ(140um) each layer, 12 layers board Surface finish: ENIG Buried/blind vias Application: DC/DC power modul