Minewing(Shenzhen) Electronics Integrated Co., Ltd

Plastic molding and injection Sheet metal stamping and punching and stamping die Painting line Die casting

Heavy copper ( 2OZ)) Layer: *6 Hole copper *5um (1mil) Surface copper *6um (2.2mil) Thickness 3

Eight-layer rigid PCB Base Material:FR4 Board thickness:1.6mm Minimum width and space:4 mil BGA Surface f

Services available: Mold design Mold manufacture Mold test Mold modification Plastic injection molding P

Mold lifespan: millions shots Materials: plastic, steel and metal Mold base: LKM/HASCO/DME Manufacture pr

Designed for NDSi Hard protection Prevents scratches and damage Different colors are available High-quali

Board thickness: 1.6mm, 1/1oz and **0ups Base materials: FR4/FR5, free halogen FR4, aluminum-based, polyimide

Layer: two Material: Fr4 Thickness: 1.6mm Solder mask: red Surface finish: immersion gold 2 to 3u-inch wit

Fashionable design Used for iPhone 4/4S Can stand upright or horizontally With comfortable grip Push the e

Make with the plastic The size of the poster were A1 size With the steel chains fixed with the ceiling near

Made of plastic Customized design are welcomed Molding and production time depends on your requirements The

Detailed terms for PCB assembly: Technical requirements: Professional surface-mounting and through-hole sol

IC marking, Engraving Logo, Programming PCBA, Aging Test, Function Test and Final Assembly Size and Par

Number of layer: double-side and multilayer (up to *6 layers) Base material: FR*4, CEM*3, Teflon, Aluminum su

Chrome-plated plastic housing with custom printing Can be screwed and assembled with other parts Total solu

Our main products are covered cell phone shell, keyboard, phone shell, mouse, exchange, translators, remote

Our PCB assembly division focuses on OEM/ODM for 1 to *2 layer PCBs *0% of the assembly process is fully auto

Board thickness: 0.1 to 3.2mm High copper weight: maximum finished 5oz Hole wall copper: maximum 2oz Minimu

Surface finishing: immersion tin Line width line spacing: 7/7 mils Material: FR*4 product layer:2 Solder m