BERGQUIST GPHC3.0 GAP PAD TGP HC3000

الوصف

BERGQUIST GPHC3.0,GAP PAD  HC 3.0,GAP PAD TGP HC***0 

BERGQUIST GAP PAD TGP HC***0 is a soft and compliant gap filling material with a thermal conductivity 

of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K 

filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring

low stress on components and boards during assembly. BERGQUIST GPHC3.0 maintains a conformable

nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness 

and/or topography.

BERGQUIST  GAP PAD HC 3.0 Typical Applications Include:

• Telecommunications

• ASICs and DSPs

• Consumer electronics

• Thermal modules to heat sinks

Configurations Available:

• Sheet form and die-cut parts

For more product information, please feel free to contact us