الوصف

The true workhorse of the SIL PAD  product family, SIL PAD**0S AC (BERGQUIST SP**0S AC)thermally  conductive insulation material is designed for a wide variety of applications  requiring high thermal performance and electrical isolation. 

These applications  also typically have low mounting  pressures for component™clamping.BERGQUIST SIL PAD **0S AC (SIL PAD TSP ***0S AC)material combines a smooth and highly compliant surface  characteristic with 

high thermalconductivity. These features optimize the thermal resistance properties at  low pressures.Applications requiring low component  clamping forces include discrete semiconductors (TO***0, TO***7 and TO***8) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of SIL PAD **0S minimizes interfacial thermal resistance and  maximizes thermal performance.

BERGQUIST SP**0S AC Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive