BERGQUIST GPVOUS GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS

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BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling Pad

GAP PAD TGP ***0VOUS, Silicone Thermal Pad For Converter

GAP PAD VO Ultra Soft  Interface Pad Heat Transfer Materials

BERGQUIST GAP PAD TGP ***0VOUS(GPVOUS)  is recommended for applications that  require a minimum amount of pressure

on components. The viscoelastic nature  of the material also gives excellent lowstress  vibration dampening and shock

absorbing characteristics. BERGQUIST GAP PAD  TGP ***0VOUS is an  electrically isolating material, which allows its use 

in applications requiring  isolation between heat sinks and highvoltage,bare-leaded devices.

BERGQUIST  GAP PAD  VO Ultra Soft  Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Between heat-generating semiconductors or magnetic components and a heat sink

• Areas where heat needs to be transferred to a frame, chassis, or other type of

heat spreader

Configurations Available:

• Sheet form and die-cut parts