Ausay Technology Co, .Limited

Layers count: 2- 40 Min Line width/spacing(mil): 2.5/2.5 Max Aspect Ratio: 22:1 Board thickness: 0.13-7.0mm Max Panel size: 23"x35" Mate

Base Material: FR4 Copper Thickness: 1oz Board Thickness: 1.6mm Min. Hole Size: 0.2mm Min. Line Width: 0.1mm Min. Line Spacing: 0.1mm Surface Finishin

Number of Layers: 1-64-Layer Base Material: FR4, High-TG , Rogers, Nelco, RCC, PTFE Copper Thickness: 0.3-12oz Board Thickness: 0.6-10mm Min. Hole Siz

Number of Layers: 8-layer Base Material: FR4 Copper Thickness: 1oz Board Thickness: 1.6mm Min. Hole Size: 0.2mm Min. Line Width: 0.1mm Min. Line Spaci

Base Material: FR4, FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflo Copper Thickness: 35um/50um, 0.5-3.0oz Board Thickness: 1.6

Layers count: 2- 40 Min Line width/spacing(mil): 2.5/2.5 Max Aspect Ratio: 22:1 Board thickness: 0.13-7.0mm Max Panel size: 23"x35" Mate

8 layers HDI print circuit board 3 mil line space and width, 1.6mm finish thickness, Surface finish with ENIG+OSP, Min via hole with 0.25mm

14 layers HDI print circuit board (pwb) with blue colors 3 mil line space and width, Surface finish with ENIG+OSP Min line width/spacing 3mil

Layers count: 2- 40 Min Line width/spacing(mil): 2.5/2.5 Max Aspect Ratio: 22:1 Board thickness: 0.13-7.0mm Max Panel size: 23"x35" Mate

Layer 8 HDI 2+4+2 Thickness 1.2mm unit size 165*116mm surface ENIG 0.05~0.1um Min hole size 0.1mm