Please enter full name.
Please enter product name.
Select Industry.
Email address already exists
Please enter Password.
Enter Conatct number.
Please enter company name.
Please enter date.
Enter Message
By Signing Up. I agree to TradeKey.com Terms of Use, Privacy Policy, IPR and receive emails related to our services
Thank you, your message has been sent.
Invalid Email.
Nanshan,Shenzhen,Guangdong,China China
الشخص الذي يمكن الاتصال به Ms. Angela You
عنوان Nanshan, Shenzhen, Guangdong
Technical description: layer:14 material FR4 tg170 Board thickness: 5.0mm Surface finish immersion gold Min through hole 0.3mm(1
Technical description: layer:12 material FR4 Board thickness: 1.6mm Surface finish flash gold Min through hole 0.1mm(4mil) Min li
Technical description: layer:6 material FR4 Board thickness: 1.0mm Surface finish immersion gold Min through hole 0.1mm(4mil) Min
Technical description: minimum space size: 0.5mm ROHS complaint No. of IC: 47 pcs Soldering components: 1080pcs Minimum component size:0201
Technical description: layer:1 material PI Board thickness: 0.13mm Surface finish HAL Min through hole 0.6mm Min line width
We will contact you soon .
Please select at least one Buyer/Supplier.
Please enter name.
Please select industry.
Enter Password
Please select country.
Please select state.
Please select city.
Please Enter Message.