HCC International Limited

minimum space size: 0.5mm ROHS complaint No. of IC: *7 pcs Soldering components: ***0pcs Minimum compo

Technical requirement: Layers: two Material: FR*4 Thickness: 1.6mm Surface processing: HAL

Layer: 4 layer Soldermask: green Thcikness: 1.6 mm Copper size: 1 oz surface finish: OSP Min. hole si

layer:Rigid 8Layers, Flexible 4Layers material PI+FR4 Board thickness: Rigid 1.0mm, Flexible 0.3mm Surface

layer:*4 material FR4 tg**0 Board thickness: 5.0mm Surface finish immersion gold Min through hole 0.3

layer:2 material PI Board thickness: 0.*5mm Surface finish immersion gold Min through hole 0.3mm Min l

Technical description: layer:*4 material FR4 tg**0 Board thickness: 5.0mm Surface finish immersion gol

Technical description: layer:*2 material FR4 Board thickness: 1.6mm Surface finish flash gold Min throu

Technical description: layer:6 material FR4 Board thickness: 1.0mm Surface finish immersion gold Min th

Technical description: minimum space size: 0.5mm ROHS complaint No. of IC: *7 pcs Soldering components:

Technical description: layer:1 material PI Board thickness: 0.*3mm Surface finish HAL Min through hole